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Major Equipment I | Name | Original | QTY | | CNC Drilling machine(total 138 spindles) | Germany | 10 | | Japan | 9 | | China | 7 | | CNC Routing machine(total 22 spindles) | Taiwan | 5 | | Shenzhen | 1 | | Scrubbing machine/Cleaning machine | Taiwan | 3 | | Hong Kong | 12 | | Desmear & PTH line | Hong Kong | 2 | | Automation plating (Gold) line | Hong Kong | 1 | | Automation plating (Tin) line | Hong Kong | 3 | | Automation panel plating line | Hong Kong | 2 | | S/M Developing line | Hong Kong | 2 | | D/F Developing line | Hong Kong | 2 | | AOI systems | USA | 5 | | Exposure machine(5KW) | Japan, Taiwan | 7 | | Exposure machine(7KW/8KW) | Japan, Taiwan | 7 | | Inner layer DES line | Taiwan, Hong Kong | 2 | | Outer Etching & Stripping line | Hong Kong | 2 | | Micro-section meter | Japan | 1 | | X-Ray machine | USA | 1 | | Planar test system | Taiwan | 1 | | IR | Hong Kong | 1 | | Lonic contamination test machine | France | 1 | Major Equipment II | Name | Original | QTY | | Screening machine | Hong Kong, Taiwan | 29 | | HAL machine | Taiwan | 1 | | Automatic ENIG line | Hong Kong | 1 | | 300T/200T/160T/110T/80T Punching machine | Taiwan, China | 13 | | CNC V-cut machine | Japan | 2 | | E-testing machine | Hong Kong | 23 | | General E-testing machine | Italy | 2 | | Flying probe tester machine | Germany | 2 | | Vacuum Package machine | Taiwan | 3 | | Plot machine | Switzerland | 2 | | OSP line | Taiwan | 2 | | Vacuum Pressing machine | Taiwan | 2 | | X-Ray target drilling machine | Taiwan | 2 | | Brown Oxide line | Hong Kong | 1 | | Conveyor Oven | Hong Kong | 3 | | TDR Characteristic impedance machine | special process to be handed outside of our facilities | 1 | | Automatic Laminate machine | Japan | 2 | Output capacity | PCB | Monthly Output | | 2005 | 2006 | 2007 | | Double side | 25,000m2 | 30,000m2 | 35,000m2 | | Multi-layer | 15,000m2 | 30,000m2 | 35,000m2 | | Total | 40,000m2 | 60,000m2 | 70,000m2 | | Flexible PCB | Monthly Output | | 2005 | 2006 | 2007 | | Single | 10,000m2 | 800m2 | 12,000m2 | | Double Side & Multi-layer | 5,000m2 | 10,000m2 | 12,000m2 | | Total | 15,000m2 | 18,000m2 | 24,000m2 | Production Capacity 
Layer Counts: 1-14 Material: FR-4, High TG FR-4, PTFE, Aluminum Base, Rogers. Maximum Size: 500mmX600mm Board Outline Tolerance: ±0.13 mm Board Thickness: 0.20mm—6.00mm Thickness Tolerance (t=0.8mm): ±8% Thickness Tolerance (t<0.8mm): ±10% Insulation Layer Thickness: 0.075mm—5.00mm Minimum Line: 0.2mm Minimum Space: 0.2mm Out-layer Copper Thickness: 35µm—175µm In-layer Copper Thickness: 17µm-175µm Drilling Hole (Mechanical): 0.15mm—6.35mm Finish Hole (Mechanical): 0.15mm—6.30mm Diameter Tolerance (Mechanical): 0.05mm Registration (Mechanical): 0.075mm Aspect Ratio: 8:1 Solder Mask Type: Ink SMT Mini. Solder Mask Width: 0.08mm Mini Solder Mask Clearance: 0.05mm Plug Hole Diameter; 0.25mm—0. 60mm Impedance Control Tolerance: ±10% Surface Finish: HASL, ENIG, Chem, Tin, Flash Gold, OSP, Gold finger 
2. Application : Telecommunication, Network, Industrial control, Medical equipment, PC& periphery 
3. 1) Characteristic: 0.5mm CSP Blind & Buried Hole Application : Blue tooth 2) Characteristic: up to 12 layer, Tg170℃ 0.8mm BGA ±10% Impendance control Application: Telecommunication, Network, Medical equipment, etc 3) Characteristic: Al-Base Application: Power supply, Power Amplifier, relay, LED,etc 4) Characteristic: Up to 16 layer, Blind & Buried hole Heavy copper 950z), Up to 6.0 mm board thickness Application: Secondary Power source Fast delivery time for prototypes (in normal working conditions): | Category | Quickest lead time | Normal lead time | | Double side | 2/3 days
| 4 days
| | 4 layers | 4/5 days
| 5/6 days
| | 6 layers | 4/5 days | 5/6 days | | 8 layers | 6/7 days
| 7/8 days
| | 10 layers | 6/7 days | 7/8 days
| | 12 layers | 8/9 days
| 9/10 days
| | 14 layers | 8/9 days
| 9/10 days
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Equipment 
